Unpacking the Differences Between COB and Traditional SMD dvLED Manufacturing Methods
When evaluating LED display pixel technologies, understanding the manufacturing processes behind them can be a game-changer to ensure the right solution is being specified for the right application.
Two prominent methods—Chip-on-Board (COB) and Surface-Mounted Device (SMD)—offer distinct benefits and challenges that impact performance and longevity. Let’s explore what sets these two approaches apart and how SiliconCore's proprietary technologies elevate industry standards.
SMD: Surface-Mounted Device
SMD involves attaching individual LED RGB pixels in a package to a printed circuit board (PCB). These PCB modules can then be encapsulated for protection. SiliconCore uses an encapsulation method called LISA that maximizes contrast with a layer of black and then a clear optical coating. Others may use encapsulation that is darker. These methods are also referred to as GOB (Glue on Board) which is not the best translation.
Benefits
Versatility: Works well for a range of applications, from indoor to outdoor displays.
Cost-Effectiveness: Relatively straightforward manufacturing process for small to medium-sized pixel pitches and is widely adopted in the industry.
Repairability: Individual LEDs can be replaced if damaged.
Visual Performance: Binning and calibration methods maximize the color of the LEDs with specs near rec.2020 color space providing better color uniformity and overall screen uniformity.
Challenges
Heat Dissipation: Higher operating temperatures can reduce lifespan and performance.
Power Consumption: Less efficient compared to newer methods.
Durability: For those that are not encapsulated, they are susceptible to damage in high-traffic or outdoor environments. You may have seen examples of this in some older indoor digital signage applications, such as retail or airports.
Viewing angles can be lower due to packaging manufacturing.
COB: Chip-on-Board
SiliconCore’s technological approach to COB manufacturing integrates LED crystals directly onto the circuit board, resulting in improved heat dissipation, thinner design and strong protection against environmental damage.
Benefits
Durability: Enhanced protection against environmental and physical damage, using our LISA process and is very similar to the one mentioned under SMD.
Efficiency: Superior heat dissipation and lower power consumption, due to elimination of wirebond manufacturing..
Visual Performance: Viewing angles are higher due to elimination of packaging. Tighter pixel pitches and higher density displays can be more easily manufactured.
Challenges
Manufacturing is still not perfected. Yields of the LED crystal to PCB can be low, due to the elimination of pick and place, where the LED can be more easily binned and chosen for better color uniformity. Repairs done at factory.
Initial Cost: Higher upfront manufacturing costs due to the complexity of the process, however prices are coming down. This method of manufacturing promises greater efficiencies when produced in mass.
Repairability: Replacing individual LEDs can be more labor-intensive and must be done at factory.
Uniformity: Method of manufacturing produces less uniform batches which are then required to use a color calibration method to compensate. This method can greatly reduce the color space and can produce a kind of color patchwork made more evident in the areas of solid colors and white fields.
Environments
SMD is ideal for environments where image quality and flexibility are priorities, such as virtual production, broadcast, executive briefing centers, indoor spectaculars, corporate deployments, larger display sizes, curves, corners and unique shapes.
Environments
COB excels in close up applications such as digital signage, education, command and control and environments requiring robust displays with exceptional image quality and longevity.
Discover how SiliconCore’s proprietary technologies elevate traditional SMD
SiliconCore: Leading the Way with Proprietary Innovations
CCIQ and ZACH Technologies in the Enlighten COB series
CCIQ (Common Cathode IQ): Manages power more effectively, achieving up to 50% lower power consumption than traditional SMD.
ZACH: Improves low-brightness performance and delivers enhanced details in the shadows for unmatched image quality.
Common Cathode IQ
What It Does: Supplies individual voltages to each LED color (red, green, blue), reducing heat generation and power consumption.
Impact: Enables cooler operating temperatures, extended product lifespan (over 100,000 hours), and 20-40% lower power usage compared to traditional methods.
LISA Encapsulation Technology
What It Does: Encapsulates LEDs at the PCB level to protect against damage and enhance robustness and contrast.
Impact: Improves durability for SMD displays while maintaining their brightness and contrast. This technology has enabled SiliconCore to create displays that double as weight-bearing surfaces, like the High Resolution 1.2mm Modular Floor
Proprietary Driver Chip Design and introducing CommonCathode IQ
What It Does: SiliconCore is the only LED manufacturer designing its own driver chips, allowing complete control over video signal from device input to LED output.
Impact: Ensures superior performance with a novel clocking scheme, higher frame rates of up to and reduced latency, making displays ideal for immersive and multi-camera environments.
The Future of COB LED Displays with SiliconCore
SiliconCore’s Enlighten COB series represents the pinnacle of dvLED technology, combining sustainability with cutting-edge performance. With a 10-40% reduction in power consumption compared to competing COB products, our displays are tailored for modern, eco-conscious environments.
By integrating LED crystals directly onto the PCB, the Enlighten series offers:
Cool-to-the-touch displays, that are thinner and better incorporated into architectural environments.
A more efficient design for; longevity, reliability with higher caliber display performance.
Crystal-clear visuals of higher resolutions with brightness levels up to 1200 nits.
Discover the Enlighten series here
Whether you’re choosing between COB and SMD, the decision should align with your project’s specific requirements. While both methods have their merits, SiliconCore’s proprietary technologies, like Common Cathode and LISA encapsulation, ensure unparalleled efficiency and durability, making our displays the premier choice for professionals seeking sustainable, high performance solutions.